VeloceRF is a powerful EDA tool bringing for the first time rapid modeling and synthesis of integrated inductors and transformers, with signoff accuracy for electromagnetic effects such as spiral-to-spiral mutual inductance, skin effect and substrate losses.
VeloceRF is the only tool of its kind with out-of-the-box support for DRC- and DFM-clean spiral inductors in a variety of nanoscale CMOS (90/65/45 nm) PDKs.
Bondwires are a popular and low-cost assembly option for a wide range of IC packages. In high-speed IC design, bondwires introduce parasitics such as inductance and magnetic coupling which may affect product performance significantly. To meet demanding requirements, IC designers now have the ability to draw, model and optimize bondwires as parts of their circuits. Package design and IC design, two traditionally isolated processes, have now become seamlessly integrated in an automated design flow.
VeloceRaptor/X is a breakthrough RLCK extraction tool with unparalleled capacity and speed in the modeling of integrated passives such as transmission lines, interconnects, digital high-speed lines, spiral inductors and metalinsulator-metal (MIM) capacitors.
The tool is powered by Helic’s renowned vector-based inductance modeling engine (VeloceRaptor™) which guarantees rapid EM model generation with no compromises in accuracy. As a layout extraction tool, VeloceRaptor/X contends and outperforms conventional EM simulators in terms of speed vs. accuracy.
VeloceRaptor/X can be combined with Helic’s VeloceRF™ toolset to provide – for the first time – a complete solution for spiral inductor synthesis and wholechip modeling of RFICs and Systems in-Package.
