“VeloceRF is a cool product! It realizes seamless design environment integration in our RFCMOS PDKs. All our RF designers are satisfied from its accuracy and user-friendliness and don’t need to use other complicated tools. We cannot imagine RF-LSI design without VeloceRF!”
“The [+21 dBm] PA met specifications on first pass silicon”
“Our new approach with Helic enables deeper and direct communication with customers on RF design issues in designer's language, other than just a COT library support. Grounding, substrate noise, magnetic coupling are just a few among those critical effects that vary the true performance of RF circuits. Dynamic PDK support reflected in shorter design-time is the key for success.”
“We knew from the start of this project that success depended on executing beyond the state of the art in mixed signal IC design. The engineering collaboration with Helic was instrumental in our first-pass design success. ClariPhy has pioneered the migration to an all-digital 10-Gbit/s PHY, and Helic's tool allowed us to implement our advanced product architecture with confidence.”
VeloceRF™ brings the most advanced inductor synthesis capabilities, significantly enhancing our RFIC design flow
VeloceRF is a critical tool for simulating inductors and high speed wires in our LC VCO and clocknet designs. We’ve been really happy with Helic's customer service.
VeloceRF is a critical tool for simulating inductors and high speed wires in our LC VCO and clocknet designs. We’ve been really happy with Helic's customer service.
The advanced inductor synthesis capabilities and accurancy of VeloceRF perfectly matched our requirements. Moreover, the Pcell flexibility as well as the fast and accurate modeling of coupling parasitics enable us to reduce the size of our layouts and come up with compact, optimized floor plans.
VeloceRF is a powerful EDA tool featuring unique rapid modeling and synthesis capabilities for integrated inductors and transformers, with signoff accuracy for electromagnetic effects such as spiral-to-spiral mutual inductance, skin effect and substrate losses.
VeloceRF is the only tool of its kind with out-of-the-box support for DRC- and DFM-clean spiral inductors in a variety of nanoscale CMOS PDKs.
VeloceRF is the tool of choice among industry leaders such as Freescale, Broadcom, Fujitsu Semiconductor, RF Micro Devices and Sharp, and empowers them to push the envelope in RF and high-speed silicon integration.
Helic tools bring a lot of value when frequency goes up, significantly assisting our complex networking and radar design applications.
VeloceRaptor/X’s ease of use and unparalleled modeling capacity makes it an ideal solution for extracting RLCK parasitics from complex layouts featuring custom devices, t-line networks and power grids.
“VeloceRF and VeloceRaptor/X™ helped us to optimize our floor plan and design with high speed and accuracy.
VeloceRaptor/X™ offers high-speed and accurate electromagnetic analysis assisting our engineers in de-risking our multi-GHz designs.
VeloceRaptor/X is an indispensable tool in the design flow of high-speed and high-frequency silicon integrated circuits. A breakthrough EM extractor engine, VeloceRaptor/X brings unparalleled capacity and speed in the modeling of integrated passives, transmission lines, interconnects, digital high-speed lines, spiral inductors, MIM and MOM capacitors.
VeloceRaptor/X is winning benchmark after industry benchmark over its competition. See why industry leaders such as Freescale, Broadcom, Fujitsu Semiconductor, Sharp and NetLogic Microsystems have adopted VeloceRaptor/X. Request a demo today.
With VeloceWired® we managed to design an optimum input-matching network for our LNA block. The results lead to successful mass production of a silicon LNB with the first parts shipping to customers in April 2011.
Bondwires are a popular and low-cost assembly option for a wide range of IC packages. In high-speed IC design, bondwires introduce parasitics such as inductance and magnetic coupling which may affect product performance significantly. To meet demanding requirements, IC designers now have the ability to draw, model and optimize bondwires as parts of their circuits. Package design and IC design, two traditionally isolated processes, have now become seamlessly integrated in an automated design flow.
VeloceWired has been adopted by leading semiconductor companies such as Sharp, helping them achieve unprecedented RF performance while maintaining the low cost benefits of silicon integration.
